Browsing by author "Debecker, Bjorn"
Now showing items 1-8 of 8
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Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Gonzalez, Mario; Vandevelde, Bart; Ivankovic, Andrej; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012) -
Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014) -
Delamination in BEOL: analysis of interface failure by combined experimental & modeling approaches
Debecker, Bjorn; Vanstreels, Kris; Gonzalez, Mario; Vandevelde, Bart (2013) -
IC-package interaction
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Second level joint failures due to excessive warpage of advanced IC packages
Debecker, Bjorn; Vandevelde, Bart; Willems, Geert; Allaert, Bart (2013) -
Strength analysis of advanced node BEOL under CPI induced stresses
Debecker, Bjorn; Vanstreels, Kris; Gonzalez, Mario; Vandevelde, Bart; Tokei, Zsolt (2013)