Browsing by author "Degrendele, Lieven"
Now showing items 1-7 of 7
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3D Multifunctional composites based on large-area stretchable circuit with thermoforming technology
Yang, Yang; Vervust, Thomas; Dunphy, Sheila; Van Put, Steven; Vandecasteele, Bjorn; Dhaenens, Kristof; Degrendele, Lieven; Mader, Lothar; De Vriese, Linde; Martens, Tom; Kaufmann, Markus; Sekitiani, Tsyoshi; Vanfleteren, Jan (2018) -
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask
Siau, Sam; Degrendele, Lieven; De Baets, Johan; Van Calster, Andre (2003) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04) -
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Vandevelde, Bart; Degrendele, Lieven; Cauwe, Maarten; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2016-04) -
In situ monitoring of urine and sweat contamination in bed linen
Van Keymeulen, Bjorn; Degrendele, Lieven; Bossuyt, Frederick; De Baets, Johan (2013) -
Reduced 2nd level solder joint life time of low-CTE mold compound packages
Vandevelde, Bart; Labie, Riet; Degrendele, Lieven; Cauwe, Maarten; De Baets, Johan; Willems, Geert (2014-05)