Reduced 2nd level solder joint life time of low-CTE mold compound packages

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Authors
Vandevelde, Bart; Labie, Riet; Degrendele, Lieven; Cauwe, Maarten; De Baets, Johan; Willems, Geert
Conference
5th Electronic Materials, Processes and Packaging for Space Workshop - EMPPS
Title
Reduced 2nd level solder joint life time of low-CTE mold compound packages
Publication type
Proceedings paper
Embargo date
9999-12-31
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