Publication:

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Date

2014-05
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorLabie, Riet
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorCauwe, Maarten
dc.contributor.authorDe Baets, Johan
dc.contributor.authorWillems, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-22T07:30:18Z
dc.date.available2021-10-22T07:30:18Z
dc.date.embargo9999-12-31
dc.date.issued2014-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24730
dc.identifier.urlhttps://escies.org/webdocument/showArticle?id=992&groupid=6
dc.source.conference5th Electronic Materials, Processes and Packaging for Space Workshop - EMPPS
dc.source.conferencedate20/05/2014
dc.source.conferencelocationNoordwijk Nederland
dc.title

Reduced 2nd level solder joint life time of low-CTE mold compound packages

dc.typeProceedings paper
dspace.entity.typePublication
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