Publication:

Reduced 2nd level solder joint life time of low-CTE mold compound packages

Date

2014-05

Proceedings Paper

Simple item page Full metadata Statistics

Files

29830.pdf 5.94 MB

Author(s)

Vandevelde, Bart

;

;

Degrendele, Lieven

;

;

De Baets, Johan

;

Statistics

1862 since deposited on 2021-10-22

Acq. date: 2026-02-28