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Reduced 2nd level solder joint life time of low-CTE mold compound packages
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Reduced 2nd level solder joint life time of low-CTE mold compound packages
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Date
2014-05
Proceedings Paper
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29830.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Labie, Riet
;
Degrendele, Lieven
;
Cauwe, Maarten
;
De Baets, Johan
;
Willems, Geert
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Acq. date: 2025-12-16
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Views
1862
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-16
Citations