Browsing by author "Vanden Bulcke, Mathieu"
Now showing items 1-17 of 17
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An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Harkness, B.R.; Mohamed, M.; Meynen, H.; Vanlathem, E. (2003) -
Design of metal interconnects for stretchable electronic circuits
Gonzalez, Mario; Axisa, Fabrice; Vanden Bulcke, Mathieu; Brosteaux, Dominique; Vandevelde, Bart; Vanfleteren, Jan (2008) -
Design of metal interconnects for stretchable electronic circuits using finite element analysis
Gonzalez, Mario; Axisa, F.; Vanden Bulcke, Mathieu; Brosteux, D.; Vandevelde, Bart; Vanfleteren, Jan (2007) -
Elastic and conformable electronic circuits and assembies using MID in polymer
Axisa, Fabrice; Brosteaux, Dominique; De Leersnyder, Eva; Bossuyt, F.; Gonzalez, Mario; Vanden Bulcke, Mathieu; Vanfleteren, Jan (2007-01) -
Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers
Gonzalez, Mario; Vanden Bulcke, Mathieu; Vandevelde, Bart; Beyne, Eric; Lee, Yeong; Harkness, Brian; Meynen, Herman (2004) -
Integration of low stress photopatternable silicones into a wafer level package
Gardner, G.; Harkness, B.; Ohare, E.; Meynen, H.; Vanden Bulcke, Mathieu; Gonzalez, Mario; Beyne, Eric (2004-06) -
Introducing a silicone under the bump configuration for stress relief in a wafer level package
Vanden Bulcke, Mathieu; Gonzalez, Mario; Vandevelde, Bart; Winters, Christophe; Beyne, Eric; Larson, L.; Harkness, B.R.; Gardner, G.; Mohamed, M.; Sudbury-Holtschlag, J.; Meynen, H. (2003) -
Low cost elastic and conformable electronic circuits and assembies using MID in stretchable polymer
Axisa, Fabrice; Brosteaux, Dominique; De Leersnyder, Eva; Bossuyt, F.; Gonzalez, Mario; Vanden Bulcke, Mathieu; Vanfleteren, Jan (2007-06) -
Medical electronic system miniaturization using ultra thin chip embedding and stacking technology
Beyne, Eric; Vanden Bulcke, Mathieu; Iker, Francois; Baert, Kris; Van Hoof, Chris (2007) -
Modeling of stretchable interconnections
Gonzalez, Mario; Axisa, Fabrice; Vanden Bulcke, Mathieu; Brosteaux, Dominique; Vandevelde, Bart; Vanfleteren, Jan (2007) -
Optimization of a silicone under the bump (SUB) structure for wafer level packaging
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Larson, L.; Harkness, B.R.; Mohamed, M.; Meynen, H. (2003) -
Patternable silicones for next generation packaging reliability requirements
Kunselman, Michael; Larson, Lyndon; Harkness, Brian; Gardner, Geoff; Alger, James; Cummings, Michelle; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Photopatternable silicone compositions for electronics packaging applications
Harkness, Brian R.; Gardner, Geoff B.; Alger, James S.; Cummings, Michelle R.; Princing, Jennifer; Lee, Yeong; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Process technology for the fabrication of a chip-in-wire style packaging
Vanden Bulcke, Mathieu; Iker, Francois; De Preter, Inge; Muller, Philippe; Soussan, Philippe; Beyne, Eric; Van Hoof, Chris; Baert, Kris (2008-05) -
Study of the integration of a new elastomeric material in a silicone under the bump configuration
Vanden Bulcke, Mathieu; Gonzalez, Mario; Winters, Christophe; Beyne, Eric; Meynen, Herman; Gardner, Geoff; Harkness, Brian (2004) -
Technology develpments to initiate a next generation of cochlear implants
Volckaerts, B.; Corless, A.R.; Mercanzini, A.; Silmon, A.M.; Bertsch, A.; Van Himbeeck, C.; Wasikiewicz, J.; Vanden Bulcke, Mathieu; Vadgama, P.; Renaud, P. (2007) -
Ultra low stress and low temperature patternable silicone materials for applications within microelectronics
Meynen, Herman; Vanden Bulcke, Mathieu; Gonzalez, Mario; Harkness, Brian; Gardner, Geoff; Sudbury-Holtschlag, Joan; Vandevelde, Bart; Winters, Christophe; Beyne, Eric (2004)