Browsing by author "Matsushita, K"
Now showing items 1-3 of 3
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A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film
Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007) -
Integration of porogen-based low-k films: influence of capping layer thickness and long thermal anneals on low-k damage and reliability
De Roest, David; Vereecke, Bart; Huffman, Craig; Heylen, Nancy; Croes, Kristof; Arai, H; Takamure, N; Beynet, Julien; Sprey, Hessel; Matsushita, K; Kobayashi, N; Verdonck, Patrick; Demuynck, Steven; Beyer, Gerald; Tokei, Zsolt (2009) -
Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route
De Roest, David; Travaly, Youssef; Beynet, J.; Sprey, Hessel; Labat, J.; Huffman, Craig; Verdonck, Patrick; Kaneko, S; Matsushita, K; Kobayashi, N; Beyer, Gerald (2010)