Browsing by author "Vendier, O."
Now showing items 1-10 of 10
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Dynamic compact thermal models for an ultra thin chip stacking technology
Palacin, J.; Salleras, M.; Marco., S.; Marty, A.; Tasselli, J.; Van Hoof, Rita; Beyne, Eric; Vendier, O.; Coella-Vera, A. (2002) -
Example of MNT implementation to realise V band active primary feed for satellite antenna application
Vendier, O.; Schaffauser, C.; Cailloce, Y.; Drevon, C.; Cazaux, J.L.; Lafond, O.; Himdi, M.; Carchon, Geert; Jourdain, Anne; Siebe, B.; Schoebel, J. (2005) -
Exploring the limits of Arrhenius-based life testing with heterojunction bipolar transistor technology
Petersen, R.; De Ceuninck, Ward; D'Haen, Jan; D'Olieslaeger, Marc; De Schepper, Luc; Vendier, O.; Blanck, H.; Pons, D. (2002) -
Multi-layer thin-film MCM-D for the realization of Q- and V-band functions
Carchon, Geert; Brebels, Steven; Vendier, O.; De Raedt, Walter (2003) -
Residual thermo-mechanical stresses in thinned-chip assemblies
Leseduarte, S.; Marco, S.; Beyne, Eric; Van Hoof, Rita; Marty, A.; Pinel, S.; Vendier, O.; Coello-Vera, A. (1999) -
Residual thermomechanical stresses in thinned-chip assemblies
Leseduarte, S.; Marco, S.; Beyne, Eric; Van Hoof, Rita; Marty, A.; Pinel, S.; Vendier, O.; Coello-Vera, A. (2000) -
Thermal management in a new ultra-thin chip stack technology
Pinel, S.; Tasselli, J.; Bailbe, J. P.; Marty, A.; Marco, S.; Morante, J. R.; Beyne, Eric; Van Hoof, Rita; Vendier, O.; Huan, M. (2001) -
Thermal modeling and management in ultrathin chip stack technology
Pinel, S.; Marty, A.; Tasselli, J.; Bailbe, J. P.; Beyne, Eric; Van Hoof, Rita; Marco, S.; Morante, J. R.; Vendier, O.; Huan, M. (2002) -
Ultra thin electronics for space applications
Vendier, O.; Huan, M.; Drevofi, C.; Cazaux, J. L.; Beyne, Eric; Van Hoof, Rita; Marty, A.; Pinel, S.; Tasselli, J.; Marco, S.; Morante, J. R. (2001) -
UTCS: ultra thin chip stacking a WSI emulation technology
Coello-Vera, A.; Vendier, O.; Beyne, Eric; Van Hoof, Rita; Pinel,; Bailbé, J.P. (2000)