Now showing items 1-6 of 6

    • 3D measurement of 3D NAND memory hole with CD-SEM and tilted FIB 

      Ohashi, Takeyoshi; Yamaguchi, Atsuko; Hasumi, Kazuhisa; Ikota, Masami; Tan, Chi Lim; Raymaekers, Tom; Van den Bosch, Geert; Furnemont, Arnaud; Lorusso, Gian (2017)
    • Enabling CD SEM metrology for 5nm technology node and beyond 

      Lorusso, Gian; Ohashi, Takeyoshi; Yamaguchi, Astuko; Inoue, Osamu; Sutani, Takumichi; Horiguchi, Naoto; Boemmels, Juergen; Wilson, Chris; Briggs, Basoene; Tan, Chi Lim; Raymaekers, Tom; Delhougne, Romain; Van den Bosch, Geert; Di Piazza, Luca; Kar, Gouri Sankar; Furnemont, Arnaud; Fantini, Andrea; Donadio, Gabriele Luca; Souriau, Laurent; Crotti, Davide; Yasin, Farrukh; Appeltans, Raf; Rao, Siddharth; De Simone, Danilo; Rincon Delgadillo, Paulina; Leray, Philippe; Charley, Anne-Laure; Zhou, Daisy; Veloso, Anabela; Collaert, Nadine; Hasumi, Kazuhisa; Koshihara, Shunsuke; Ikota, Masami; Okagawa, Yutaka; Ishimoto, Toru (2017)
    • First demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices 

      Delhougne, Romain; Arreghini, Antonio; Rosseel, Erik; Hikavyy, Andriy; Vecchio, Emma; Zhang, Liping; Pak, Murat; Nyns, Laura; Raymaekers, Tom; Jossart, Nico; Breuil, Laurent; Vadakupudhu Palayam, Senthil; Tan, ChiLim; Van den Bosch, Geert; Furnemont, Arnaud (2018)
    • First demonstration of MOVPE In1-xGaxAs macaroni channel for 3-D NAND memory devices 

      Ramesh, Siva; Vadakupudhu Palayam, Senthil; Rosseel, Erik; Arreghini, Antonio; Kunert, Bernardette; Baryshnikova, Marina; Zhang, Liping; Ong, Patrick; Teugels, Lieve; Pak, Murat; Jossart, Nico; Raymaekers, Tom; Stiers, Jimmy; Van den Bosch, Geert; Furnemont, Arnaud (2019)
    • From planar to vertical capacitors : a first step towards ferroelectric V-FeFET integration 

      Florent, Karine; Lavizzari, Simone; Di Piazza, Luca; Popovici, Mihaela Ioana; Potoms, Goedele; Raymaekers, Tom; Groeseneken, Guido; Van Houdt, Jan (2017)
    • In depth analysis of 3D NAND enablers in gate stack integration and demonstration in 3D devices 

      Tan, Chi Lim; Lavizzari, Simone; Blomme, Pieter; Breuil, Laurent; Vecchio, Emma; Sebaai, Farid; Paraschiv, Vasile; Tao, Zheng; Schepers, Bart; Nyns, Laura; Peter, Antony; Dekkers, Harold; Ong, Patrick; Tsvetanova, Diana; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Raymaekers, Tom; Jossart, Nico; Mennella, Pasquale; Delhougne, Romain; Vadakupudhu Palayam, Senthil; Arreghini, Antonio; Van den Bosch, Geert; Furnemont, Arnaud (2017)