Browsing by author "Michelon, Julien"
Now showing items 1-8 of 8
-
A feasibility study of dual damascene porous SiLK resin with spin-on hard masks
Hoofman, Romano; Michelon, Julien; Verheijden, G.J.A.M.; Waeterloos, Joost; Caluwaerts, Rudy; Schmidt, M.O.; Demeurisse, Caroline; Vandeweyer, Tom; Demuynck, Steven; Tokei, Zsolt; Beyer, Gerald (2004) -
Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2003) -
Alpha-Ta formation and its impact on electromigration
Demuynck, Steven; Tokei, Zsolt; Bruynseraede, Christophe; Michelon, Julien; Maex, Karen (2004) -
Challenges in the implentation of low-k dielectrics in the back-end of line
Hoofman, Romano; Brom - Verheyden, Greja; Michelon, Julien; Iacopi, Francesca; Travaly, Youssef; Baklanov, Mikhaïl; Tokei, Zsolt; Beyer, Gerald (2005) -
Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers
Bruynseraede, Christophe; Fisher, A.H.; Ungar, F.; Schuhmacher, Jorg; Sutcliffe, Victor; Michelon, Julien; Maex, Karen (2004) -
Electromigration study of sub-100nm Cu-lines
Michelon, Julien; Bruynseraede, Christophe; Tio Castro, David; Roussel, Philippe; Hoofman, Romano; Maex, Karen (2005) -
The impact of scaling on interconnect reliability
Bruynseraede, Christophe; Tokei, Zsolt; Iacopi, Francesca; Beyer, Gerald; Michelon, Julien; Maex, Karen (2005) -
Void growth modeling upon electromigration stressing in single damascene cu lines
Tio Castro, David; Hoofman, Romano; Michelon, Julien; Bruynseraede, Christophe (2007)