Browsing by author "Uhrmann, Thomas"
Now showing items 1-4 of 4
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A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Iacovo, Serena; D'have, Koen; Okudur, Oguzhan Orkut; De Vos, Joeri; Uhrmann, Thomas; Plach, Thomas; Conard, Thierry; Meersschaut, Johan; Bex, Pieter; Brems, Steven; Phommahaxay, Alain; Gonzalez, Mario; Witters, Liesbeth; Beyer, Gerald; Beyne, Eric (2023) -
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
Iacovo, Serena; Peng, Lan; Nagano, Fuya; Uhrmann, Thomas; Burggraf, Jurgen; Fehkuhrer, Andreas; Conard, Thierry; Inoue, Fumihiro; Kim, Soon-Wook; De Vos, Joeri; Phommahaxay, Alain; Beyne, Eric (2021) -
Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2016) -
Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications
De Vos, Joeri; Peng, Lan; Van Ongeval, Joost; Phommahaxay, Alain; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2017)