Browsing by author "Wu, Wen"
Now showing items 1-16 of 16
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Barriers for Cu/low k damascene structures
Maex, Karen; Tokei, Zsolt; Satta, Alessandra; Lanckmans, Filip; Wu, Wen; Iacopi, Francesca (2001) -
Corrosion of narrow copper damascene interconnects
Ernur, Didem; Terzieva, Valentina; Wu, Wen; Brongersma, Sywert; Maex, Karen (2004) -
Corrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters
Ernur, Didem; Wu, Wen; Brongersma, Sywert; Terzieva, Valentina; Maex, Karen (2004) -
Electrical and microstructural characterization of narrow Cu interconnects
Wu, Wen; Brongersma, Sywert; Vervoort, Iwan; Bender, Hugo; Van Hove, Marleen; Maex, Karen (2004) -
Electrical and microstructural characterization of narrow Cu interconnects
Wu, Wen; Brongersma, Sywert; Vervoort, Iwan; Bender, Hugo; Van Hove, Marleen; Maex, Karen (2003) -
Fabrication and transport properties of ultra-fine copper interconnects
Wu, Wen (2004-09) -
Fabrication of 100 nm pitch copper interconnects by electron beam lithography
Wu, Wen; Jonckheere, Rik; Tokei, Zsolt; Brongersma, Sywert; Van Hove, Marleen; Maex, Karen (2004) -
Grain growth in copper interconnect lines
Wu, Wen; Ernur, Didem; Brongersma, Sywert; Van Hove, Marleen; Maex, Karen (2004) -
Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects
Ernur, Didem; Wu, Wen; Brongersma, Sywert; Terzieva, Valentina; Maex, Karen (2004) -
Influence of surface and grain-boundary scattering on the resistivity of copper in reduced dimensions
Wu, Wen; Brongersma, Sywert; Van Hove, Marleen; Maex, Karen (2004) -
Integration of single damascene 85/85nm/L/S copper trenches in black diamond using 193nm optical lithography with dipole illumination
Van Olmen, Jan; Wu, Wen; Van Hove, Marleen; Travaly, Youssef; Brongersma, Sywert; Eyckens, Brenda; Maenhoudt, Mireille; Van Aelst, Joke; Struyf, Herbert; Demuynck, Steven; Tokei, Zsolt; Vervoort, Iwan; Sijmus, Bram; Vos, Ingrid; Ciofi, Ivan; Stucchi, Michele; Maex, Karen; Iacopi, Francesca (2003) -
Non-destructive determination of pore size distribution of low-k porous SOG films
Baklanov, Mikhaïl; Kondoh, Eiichi; Gidley, D.; Lin, E.; Wu, Wen; Arao, H.; Mogilnikov, K. P.; Shamiryan, Denis; Nakashima, A. (2000) -
Resistivity of ultra-narrow Cu interconnects fabricated with ion beam lithography
Wu, Wen; Jonckheere, Rik; Tokei, Zsolt; Stucchi, Michele; Struyf, Herbert; Vos, Ingrid; Bender, Hugo; Maex, Karen (2003) -
Studies on size effect of copper interconnect lines
Wu, Wen; Maex, Karen (2001) -
The thickness and temperature dependent resistivity of thin copper films
Zhang, Wenqi; Brongersma, Sywert; Clarysse, Trudo; Wu, Wen; Vervoort, Iwan; Palmans, Roger; Hoflijk, Ilse; Bender, Hugo; Hui, W.; Carbonell, Laure; Rosseel, Erik; Vandervorst, Wilfried; Maex, Karen (2003) -
Thickness and temperature dependent resistivity of thin copper films
Zhang, Wenqi; Brongersma, Sywert; Clarysse, Trudo; Wu, Wen; Vervoort, Iwan; Palmans, Roger; Hoflijk, Ilse; Bender, Hugo; Hui, W.; Carbonell, Laure; Rosseel, Erik; Vandervorst, Wilfried; Maex, Karen (2004)