Browsing by author "Priyabadini, Swarnakamal"
Now showing items 1-8 of 8
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3D stacking of ultra-thin chip packages: an innovative packaging and interconnection technology
Priyabadini, Swarnakamal; Sterken, Tom; Van Hoorebeke, Luc; Vanfleteren, Jan (2013-07) -
3D-stacking of ultra-thin chips and chip packages
Priyabadini, Swarnakamal (2013-11) -
3D-stacking of UTCPs as a module miniaturisation
Priyabadini, Swarnakamal; Gielen, An; Dhaenens, Kristof; Christiaens, Wim; Van Put, Steven; Kunkel, G.; Petersen, A.E.; Vanfleteren, Jan (2011) -
3D-stacking of UTCPs as a module miniaturisation technology
Priyabadini, Swarnakamal (2011) -
An approach to produce a stack of photo definable polyimide based flat UTCPs
Priyabadini, Swarnakamal; Sterken, Tom; Wang, Liang; Dhaenens, Kristof; Vandecasteele, Bjorn; Van Put, Steven; Petersen, A.E.; Vanfleteren, Jan (2012) -
High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Sterken, Tom; Op de Beeck, Maaike; Vermeiren, Filip; Torfs, Tom; Wang, Liang; Priyabadini, Swarnakamal; Dhaenens, Kristof; Cuypers, Dieter; Vanfleteren, Jan (2012) -
High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages
Priyabadini, Swarnakamal; Sterken, Tom; Cauwe, Maarten; Van Hoorebeke, Luc; Vanfleteren, Jan (2014) -
Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
Priyabadini, Swarnakamal; Sterken, Tom; Op de Beeck, Maaike; Vanfleteren, Jan (2013)