Browsing by author "Dosseul, Franck"
Now showing items 1-3 of 3
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Electromigration failure mechanisms for different flip chip configurations
Labie, Riet; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Croes, Kristof; Vandevelde, Bart; Dosseul, Franck (2011) -
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Vandevelde, Bart; Labie, Riet; Cherman, Vladimir; Webers, Tomas; Winters, Christophe; Beyne, Eric; Dosseul, Franck (2011) -
Outperformance of Cu pillar flip chip bumps in electromigration testing
Labie, Riet; Dosseul, Franck; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Beyne, Eric; Vandevelde, Bart (2011)