Browsing by author "Meynen, H."
Now showing items 1-5 of 5
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An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Harkness, B.R.; Mohamed, M.; Meynen, H.; Vanlathem, E. (2003) -
Integration of low stress photopatternable silicones into a wafer level package
Gardner, G.; Harkness, B.; Ohare, E.; Meynen, H.; Vanden Bulcke, Mathieu; Gonzalez, Mario; Beyne, Eric (2004-06) -
Introducing a silicone under the bump configuration for stress relief in a wafer level package
Vanden Bulcke, Mathieu; Gonzalez, Mario; Vandevelde, Bart; Winters, Christophe; Beyne, Eric; Larson, L.; Harkness, B.R.; Gardner, G.; Mohamed, M.; Sudbury-Holtschlag, J.; Meynen, H. (2003) -
Optimization of a silicone under the bump (SUB) structure for wafer level packaging
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Larson, L.; Harkness, B.R.; Mohamed, M.; Meynen, H. (2003) -
Process optimization and integration of trimethylsilane-deposited a-SiC:H and a-SiCO:H dielectric thin films for damascene processing
Gray, W.D.; Loboda, M.J.; Bremmer, J.N.; Struyf, Herbert; Lepage, Muriel; Van Hove, Marleen; Alves Donaton, Ricardo; Sleeckx, Erik; Stucchi, Michele; Lanckmans, Filip; Gao, Teng; Boullart, Werner; Coenegrachts, Bart; Maenhoudt, Mireille; Vanhaelemeersch, Serge; Meynen, H.; Maex, Karen (2003)