Browsing by author "Bisson, Peter"
Now showing items 1-4 of 4
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300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11) -
Process characterization of thin wafer debonding with thermoplastic materials
Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Stieber, Ralf; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012) -
Temporary wafer bonding defect impact assessment on substrate thinning, process enhancement through systematic defect track down
Phommahaxay, Alain; Verbinnen, Greet; Suhard, Samuel; Bex, Pieter; Van den Eede, Axel; Pancken, Joris; Lismont, Mark; Jourdain, Anne; Woitke, Tobias; Bisson, Peter; Spiess, Walter; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012) -
Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Phommahaxay, Alain; Jourdain, Anne; Verbinnen, Greet; Woitke, Tobias; Bisson, Peter; Gabriel, Markus; Spiess, Walter; Guerrero, Alice; McCutcheon, Jeremy; Puligadda, Rama; Bex, Pieter; Van den Eede, Axel; Swinnen, Bart; Beyer, Gerald; Miller, Andy; Beyne, Eric (2012)