Browsing by author "Strid, Eric"
Now showing items 1-3 of 3
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Evaluation of TSV and micro-bump probing for wide I/O testing
Smith, Ken; Hanaway, Peter; Jolley, Mike; Gleason, Reed; Strid, Eric; Daenen, Tom; Dupas, Luc; Knuts, Bruno; Marinissen, Erik Jan; Van Dievel, Marc (2011-09) -
Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
Marinissen, Erik Jan; Daenen, Tom; Dupas, Luc; Van Dievel, Marc; Hanaway, Peter; Kiesewetter, Joerg; Smith, Ken; Strid, Eric; Thaerigen, Thomas (2011) -
Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
Thaerigen, Thomas; Kanev, Stojan; Kiesewetter, Joerg; Hanaway, Peter; Strid, Eric; Marinissen, Erik Jan; Dupas, Luc (2011-10)