Browsing by author "Krishnan, Sitaraman"
Now showing items 1-4 of 4
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Effect of deposition methods on material removal rate during nickel CMP
Wang, Yanni; Teugels, Lieve; Vandersmissen, Kevin; De Gendt, Stefan; Krishnan, Sitaraman; Struyf, Herbert (2017-10) -
Fundamental investigation of chemical mechanical polishing of GaAs in ailica dispersions: Material removal and arsenic trihydride formation pathways
Ong, Patrick; Matovu, J.B.; Leunissen, Peter; Krishnan, Sitaraman; Babu, S.V. (2013) -
Inspection, characterization and classification of defects for improved CMP of III-V materials
Bhonsle, Rithu; Teugels, Lieve; Usman Ibrahim, Ansar; Ong, Patrick; Delande, Tinne; Krishnan, Sitaraman; Siebert, Max; Struyf, Herbert; Leunissen, Leonardus (2015) -
Use of multifunctional carboxylic acids and hydrogen peroxide to improve surface quality and minimize phosphine evolution during chemical mechanical polishing of indium phosphide surfaces
Matovu, John Bogere; Ong, Patrick; Krishnan, Sitaraman; Babu, S.V.; Leunissen, Peter (2013)