Browsing by author "Stoukatch, Serguei"
Now showing items 21-30 of 30
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Miniaturization using 3-D stack structure for SIP applications
Stoukatch, Serguei; Ho, Meng; Vaesen, Kristof; Webers, Tomas; Carchon, Geert; De Raedt, Walter; Beyne, Eric; De Baets, Johan (2003) -
Mixed assembly of PCB using a novel flip-chip technology
Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandamme, Lorenz; Allaert, K. (2000) -
Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
Stoukatch, Serguei; Vaesen, Kristof; Ho, Meng; Beyne, Eric (2002) -
Mixed assembly on PCB using a novel flip-chip technology
Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandam, L.; Allaert, K. (2000) -
Paving the way for copper-to-copper wire bonding by thorough optimization - Oxide prevention is the key
Van Bavel, Mieke; Degryse, Dominiek; Stoukatch, Serguei; Vandevelde, Bart; Beyne, Eric (2003) -
Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs
Jourdain, Anne; Stoukatch, Serguei; De Moor, Piet; Ruythooren, Wouter; Pargfrieder, S.; Swinnen, Bart; Beyne, Eric (2007-06) -
Single-package 5GHz WLAN RF module with embedded patch antenna and 20dBm power amplifier
Ryckaert, Julien; Brebels, Steven; Côme, Boris; Diels, Wim; Hauspie, Dries; Stoukatch, Serguei; Vaesen, Kristof; De Raedt, Walter; Donnay, Stephane (2003) -
The influence of packaging materials on RF performance
Chandrasekhar, Arun; Brebels, Steven; Stoukatch, Serguei; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2002) -
The influence of packaging materials on RF performance
Chandrasekhar, Arun; Brebels, Steven; Stoukatch, Serguei; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2003) -
Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS application
Stoukatch, Serguei; Webers, Tomas; Winters, Christophe; Baert, Kris; Beyne, Eric (2004)