Browsing by author "Cockburn, Andrew"
Now showing items 21-29 of 29
-
On the thermal stability of physically-vapor-deposited diffusion barriers in 3D through-silicon vias during IC processing
Civale, Yann; Croes, Kristof; Miyamori, Yuichi; Velenis, Dimitrios; Redolfi, Augusto; Thangaraju, Sarasvathi; Van Ammel, Annemie; Cherman, Vladimir; Van der Plas, Geert; Cockburn, Andrew; Gravey, Virginie; Kumar, Nirajan; Cao, Zhitao; Travaly, Youssef; Tokei, Zsolt; Beyne, Eric; Swinnen, Bart (2013) -
Plasma enhanced atomic layer deposition of ruthenium ultra-thin films for advanced metallization
Swerts, Johan; Armini, Silvia; Carbonell, Laure; Delabie, Annelies; Franquet, Alexis; Mertens, Sofie; Schaekers, Marc; Witters, Thomas; Tokei, Zsolt; Beyer, Gerald; Van Elshocht, Sven; Gravey, Virginie; Cockburn, Andrew; Shah, Kavita; Aubuchon, Joseph (2010) -
Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
Heylen, Nancy; Li, Yunlong; Travaly, Youssef; Vereecke, Guy; Volders, Henny; Tokei, Zsolt; Versluijs, Janko; Rip, Jens; Beyer, Gerald; Fischer, Paul; Zhao, Larry; Santoro, Gaetano; Nguyen, Olivier; Cockburn, Andrew (2008) -
Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
Heylen, Nancy; Li, Yunlong; Kellens, Kristof; Travaly, Youssef; Vereecke, Guy; Volders, Henny; Tokei, Zsolt; Versluijs, Janko; Rip, Jens; Van Besien, Els; Carbonell, Laure; Beyer, Gerald; Fischer, Paul; Zhao, Larry; Santoro, Gaetano; Cockburn, Andrew; Nguyen, Olivier (2009) -
Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
Swerts, Johan; Armini, Silvia; Carbonell, Laure; Delabie, Annelies; Franquet, Alexis; Mertens, Sofie; Popovici, Mihaela Ioana; Schaekers, Marc; Witters, Thomas; Tokei, Zsolt; Beyer, Gerald; Van Elshocht, Sven; Gravey, Virginie; Cockburn, Andrew; Shah, Kavita; Aubuchon, Joseph (2012) -
Siconi for bulk FinFET (BFFT) recess etch
Cockburn, Andrew; Gravey, Virginie; Xu, T.; Diehl, D.; Redolfi, Augusto (2011) -
Spacer defined double patterning for 20nm half pitch interconnect damascene structures
Siew, Yong Kong; Cockburn, Andrew; Beyer, Gerald; Versluijs, Janko; Kunnen, Eddy; Dekkers, Harold; Volders, Henny; Ciofi, Ivan; Gravey, Virginie; Noori, Atif; Padhi, Deenesh; Shah, Kavita (2010) -
Thermal stability of copper through-silicon via barriers during IC processing
Civale, Yann; Croes, Kristof; Miyamori, Yuichi; Thangaraju, Sarasvathi; Redolfi, Augusto; Van Ammel, Annemie; Velenis, Dimitrios; Cherman, Vladimir; Hendrickx, Paul; Van der Plas, Geert; Cockburn, Andrew; Gravey, Virginie; Kumar, Nirajan; Zhitao, Cao; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Travaly, Youssef; Tokei, Zsolt; Beyne, Eric; Swinnen, Bart (2011) -
Understanding of Tunable Selector Performance in Si-Ge-As-Se OTS Devices by Extended Percolation Cluster Model Considering Operation Scheme and Material Design
Kim, W. G.; Pakala, M.; Kabuyanagi, Shoichi; Garbin, Daniele; Fantini, Andrea; Clima, Sergiu; Degraeve, Robin; Donadio, Gabriele Luca; Devulder, Wouter; Delhougne, Romain; Cellier, Daniel; Cockburn, Andrew; Suzuki, Masamichi; Goux, Ludovic; Kar, Gouri Sankar (2020)