Browsing by author "Vandecasteele, Bjorn"
Now showing items 21-40 of 41
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Integration techniques and applications of thin chips on low cost foil substrates
van den Ende, Daan; Sridhar, Ashok; van den Brand, Jeroen; Cauwe, Maarten; Vandecasteele, Bjorn (2013) -
Interconnecting drivers to flexible displays
Govaerts, Jonathan; Vandecasteele, Bjorn; Vanfleteren, Jan (2008) -
Laser-induced forward transfer-assisted flip-chip bonding of optoelectronic component
Kaur, Kamalpreet; Missinne, Jeroen; Vandecasteele, Bjorn; Van Steenberge, Geert; Perinchery, S.M.; Smits, E.C.P.; Mandamparabil, R. (2013) -
Lead-free flip chip: a comparison between lead-free solder and adhesives
Vandecasteele, Bjorn; Vanfleteren, Jan; Manessis, D.; Ostmann, A.; Hagedorn, H.W.; Wiese, J (2005-06) -
Low cost wide temperature range adhesive flip-chip technology using a combination of ICA and NCA
Vanfleteren, Jan; Vandecasteele, Bjorn; Podprocky, T. (2002) -
Low temperature flip chip attachment for flexible display applications
Vandecasteele, Bjorn; Määttänen, Jarmo; Podprocky, Tomas; Vanfleteren, Jan (2004) -
Low temperature flip chip with adhesives on PES
Vandecasteele, Bjorn; Podprocky, Tomas; Vanfleteren, Jan; Määttänen, Jarmo (2003) -
Low temperature flip-chip assembly for biomedical applications
Vanfleteren, Jan; Vandecasteele, Bjorn; Podprockŭ, T.; Jacobs, Philippe (2001) -
Low temperature flip-chip process using ICA and NCA (isotropivally and non-conductive adhesive) for flexible displays application
Vanfleteren, Jan; Vandecasteele, Bjorn; Podprocky, T. (2002) -
Mixed assembly of PCB using a novel flip-chip technology
Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandamme, Lorenz; Allaert, K. (2000) -
Mixed assembly on PCB using a novel flip-chip technology
Vanfleteren, Jan; Stoukatch, Serguei; Vandecasteele, Bjorn; Van Calster, Andre; Criel, Steven; Willems, Geert; De Langhe, Pascal; Vandam, L.; Allaert, K. (2000) -
Reduced temperature flip-chip technologies on flexible display substrates using adhesives
Vanfleteren, Jan; Vandecasteele, Bjorn; Raevens, S.; Määttänen, J.; Perttula, P. (2002) -
Reliability of different flex materials in high density flip chip on flex applications
Palm, P.; Määttänen, J.; De Maquillé, Y.; Picault, A.; Vanfleteren, Jan; Vandecasteele, Bjorn (2001) -
Reliability results of high density flip chip on flex assemblies
Määttänen, Jarmo; Vandecasteele, Bjorn; Vanfleteren, Jan; de Maquille, Yannick (2004) -
Results of a high density flip chip on flex reliability test program
Vandecasteele, Bjorn; Vanfleteren, Jan; Määttänen, Jarmo; Laitinen, Tanja; de Maquillé, Yannick (2003) -
Sn whisker evaluations in 3D microbumped structures
Vakanas, George; Vandecasteele, Bjorn; Schaubroeck, David; De Messemaeker, Joke; Willems, Geert; Ashworth, Mark A.; Wilcox, Geoffrey D.; De Wolf, Ingrid (2014) -
Technology development for a low-cost, roll-to-roll chip embedding solution based on PET foils
Cauwe, Maarten; Vandecasteele, Bjorn; Gielen, An; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel (2011) -
Thermoplastically shaped wearable medical devices
Plovie, Bart; Dunphy, Sheila; Dhaenens, Kristof; Van Put, Steven; Vandecasteele, Bjorn; Bossuyt, Frederick; Vanfleteren, Jan (2017) -
Thick film inductors for RF applications
Podprocky, Tomas; Vandecasteele, Bjorn; De Baets, Johan; Van Calster, Andre (2003) -
Ultrathin biocompatible implantable chip for bidirectional communication with peripheral nerves
Op de Beeck, Maaike; Verplancke, Rik; Schaubroeck, David; Cuypers, Dieter; Cauwe, Maarten; Vandecasteele, Bjorn; O'Callaghan, John; Braeken, Dries; Andrei, Alexandru; Firrincieli, Andrea; Ballini, Marco; Kundu, Aritra; Fahmy, Ahmed; Patrick, Erin; Maghari, Nima; Bashirullah, Rizwan; De Baets, Johan (2017)