Browsing by author "Zahedmanesh, Houman"
Now showing items 21-40 of 64
-
Electromigration and thermal storage study of barrierless Co vias
Varela Pedreira, Olalla; Croes, Kristof; Zahedmanesh, Houman; Vandersmissen, Kevin; van der Veen, Marleen; Vega Gonzalez, Victor; Dictus, Dries; Zhao, Larry; Kolics, Artur; Tokei, Zsolt (2018) -
Electromigration limits of copper nano-interconnects
Zahedmanesh, Houman; Varela Pedreira, Olalla; Tokei, Zsolt; Croes, Kristof (2021) -
Electromigration scaling limits of copper interconnects
Varela Pedreira, Olalla; Zahedmanesh, Houman; Ciofi, Ivan; Tokei, Zsolt; Croes, Kristof (2019) -
Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Ceric, H.; Zahedmanesh, Houman; Croes, Kristof; Lacerda de Orio, R.; Selberherr, S. (2023) -
EUV lithography imaging using novel pellicle membranes
Pollentier, Ivan; Vanpaemel, Johannes; Lee, Jae Uk; Adelmann, Christoph; Zahedmanesh, Houman; Huyghebaert, Cedric; Gallagher, Emily (2016) -
Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Jourdain, Anne; De Vos, Joeri; Rassoul, Nouredine; Zahedmanesh, Houman; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Ashraf, Huma; Thomas, Dave; Li, Shifang; Chang, Timothy; Hiebert, Stephen; Cross, Andrew; Stoerring, Moritz (2018) -
Fundamental analysis of the collapse of nano-patterns during wet-processing of advanced interconnects
Zahedmanesh, Houman; Le, Quoc Toan; Vanstreels, Kris; Gonzalez, Mario; Tokei, Zsolt (2017) -
High-Performance Radiation-Hardened Spintronic Retention Latch and Flip-Flop for Highly Reliable Processors
Nair, Sarath Mohanachandran; Mayahinia, Mahta; Tahoori, Mehdi B.; Perumkunnil, Manu; Zahedmanesh, Houman; Croes, Kristof; Garello, Kevin; Marinelli, Tommaso; Evenblij, Timon; Kar, Gouri Sankar; Catthoor, Francky (2021) -
Impact of Back-End-Of-Line architecture on chip-package-interaction in advanced interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020) -
Impact of Back-End-Of-Line architecture on Chip-Package-Interaction in advanced interconnects using shear microprobing and finite element simulations
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2018) -
In-situ scanning electron microscopy study of fracture events during BEOL microbeam bending tests
Vanstreels, Kris; De Wolf, Ingrid; Zahedmanesh, Houman; Bender, Hugo; Gonzalez, Mario; Lefebvre, J.; Bhowmick, S. (2014) -
Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck
Tokei, Zsolt; Vega Gonzalez, Victor; Murdoch, Gayle; O'Toole, Martin; Croes, Kristof; Baert, Rogier; van der Veen, Marleen; Adelmann, Christoph; Soulie, Jean-Philippe; Boemmels, Juergen; Wilson, Chris; Park, Seongho; Sankaran, Kiroubanand; Pourtois, Geoffrey; Swerts, Johan; Paolillo, Sara; Decoster, Stefan; Mao, Ming; Lazzarino, Frederic; Versluijs, Janko; Blanco, Victor; Ercken, Monique; Kesters, Els; Le, Quoc Toan; Holsteyns, Frank; Heylen, Nancy; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Morin, Pierre; Jourdan, Nicolas; Van Elshocht, Sven; Ciofi, Ivan; Gupta, Anshul; Zahedmanesh, Houman; Vanstreels, Kris; Na, Myung Hee (2020) -
Interconnect metals beyond copper: reliability challenges and opportunities
Croes, Kristof; Adelmann, Christoph; Wilson, Chris; Zahedmanesh, Houman; Varela Pedreira, Olalla; Wu, Chen; Lesniewska, Alicja; Oprins, Herman; Beyne, Sofie; Ciofi, Ivan; Kocaay, Deniz; Stucchi, Michele; Tokei, Zsolt (2018) -
Introducing the EUV CNT pellicle
Lee, Jae Uk; Vanpaemel, Johannes; Pollentier, Ivan; Adelmann, Christoph; Zahedmanesh, Houman; Huyghebaert, Cedric; Timmermans, Marina; De Volder, Michael; Gallagher, Emily (2016) -
Introducing the euv cnt pellicle
Gallagher, Emily; Huyghebaert, Cedric; Lee, Jae Uk; Pollentier, Ivan; Timmermans, Marina; Zahedmanesh, Houman (2016) -
Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
Zahedmanesh, Houman; Varela Pedreira, Olalla; Tokei, Zsolt; Croes, Kristof (2019) -
Mechanical integrity of back-end-of-Line with Ru nanowires and airgaps
Zahedmanesh, Houman; Vanstreels, Kris (2020) -
Mechanical integrity of nano-interconnects as brittle-matrix nano-composites
Zahedmanesh, Houman; Vanstreels, Kris; Le, Quoc Toan; Verdonck, Patrick; Gonzalez, Mario (2018) -
Mechanical integrity of nano-interconnects; the impact of metallization density
Zahedmanesh, Houman; Vanstreels, Kris (2019) -
Mechanical stability of advanced nano-interconnects
Vanstreels, Kris; Zahedmanesh, Houman; Gonzalez, Mario (2020)