Browsing by author "Waeterloos, Joost"
Now showing items 21-26 of 26
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Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
Baklanov, Mikhaïl; Muroyama, M.; Judelewicz, Moshe; Kondoh, Eiichi; Li, H.; Waeterloos, Joost; Vanhaelemeersch, Serge; Maex, Karen (1999) -
Reduction of the premetal dielectric thermal budget for a 0.35 μm technology
Waeterloos, Joost; Meynen, Herman; de Potter de ten Broeck, Muriel; Coenegrachts, Bart; Gao, Teng; Grillaert, Joost; Van den hove, Luc; Maex, Karen (1996) -
Surface characterization of a low dielectric constant polymer-SiLK polymer, and investigation of its interface with Cu
Rajagopal, A.; Grégoire, C.; Lemaire, J. J.; Pireaux, J. J.; Baklanov, Mikhaïl; Vanhaelemeersch, Serge; Maex, Karen; Waeterloos, Joost (1999) -
The evaluation and the inegration of low-k organic spin-on materials in a non-etchback interconnect process
Meynen, Herman; Waeterloos, Joost; Coenegrachts, Bart; Gao, Teng; Grillaert, Joost; Van den hove, Luc (1996) -
The integration of a low-k material with high organic content in a non-etchback process
Waeterloos, Joost; Meynen, Herman; Coenegrachts, Bart; Vanhaelemeersch, Serge; Grillaert, Joost; Van den hove, Luc (1996) -
Thermal budget limitations when integrating a low-k hydrogen silsesquioxane interconnect technology
Waeterloos, Joost; Maex, Karen (1998)