Browsing by author "Vandersmissen, Kevin"
Now showing items 41-49 of 49
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Scaling of double-gated WS2 FETs to sub-5nm physical gate length fabricated in a 300mm FAB
Smets, Quentin; Schram, Tom; Verreck, Devin; Cott, Daire; Groven, Benjamin; Ahmed, Zubair; Kaczer, Ben; Mitard, Jerome; Wu, Xiangyu; Kundu, Souvik; Mertens, Hans; Radisic, Dunja; Thiam, Arame; Li, Waikin; Dupuy, Emmanuel; Tao, Zheng; Vandersmissen, Kevin; Maurice, Thibaut; Lin, Dennis; Morin, Pierre; Asselberghs, Inge; Radu, Iuliana (2021) -
Tailoring IGZO-TFT architecture for capacitorless DRAM, demonstrating > 10(3)s retention, > 10(11) cycles endurance and L-g scalability down to 14nm
Belmonte, Attilio; Oh, Hyungrock; Subhechha, Subhali; Rassoul, Nouredine; Hody, Hubert; Dekkers, Harold; Delhougne, Romain; Ricotti, Lorenzo; Banerjee, Kaustuv; Vaisman Chasin, Adrian; van Setten, Michiel; Puliyalil, Harinarayanan; Pak, Murat; Teugels, Lieve; Tsvetanova, Diana; Vandersmissen, Kevin; Kundu, Shreya; Heijlen, Jeroen; Batuk, Dmitry; Geypen, Jef; Goux, Ludovic; Kar, Gouri Sankar (2021) -
Through-silicon via technology for three-dimensional integrated circuit manufacturing
Civale, Yann; Redolfi, Augusto; Jaenen, Patrick; Kostermans, Maarten; Van Besien, Els; Mertens, Sofie; Witters, Thomas; Jourdan, Nicolas; Armini, Silvia; Vandersmissen, Kevin; Philipsen, Harold; Verdonck, Patrick; Heylen, Nancy; Nolmans, Philip; Li, Yunlong; Croes, Kristof; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Towards electrical verification of contact holes obtained with DSA of BCP
Rincon Delgadillo, Paulina; Bekaert, Joost; Vandenbroeck, Nadia; Gronheid, Roel; Chan, BT; van der Veen, Marleen; Vandersmissen, Kevin; Boemmels, Juergen; Luong, Vinh (2015) -
Trends in scaling the Cu metallization
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Vandersmissen, Kevin; Wilson, Chris; Varela Pedreira, Olalla; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2017) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Y.S.; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2011) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011) -
Wafer-Scale Integration of Single Layer Graphene Electro-Absorption Modulators in a 300 mm CMOS Pilot Line
Wu, Cheng-Han; Brems, Steven; Yudistira, Didit; Cott, Daire; Milenin, Alexey; Vandersmissen, Kevin; Maestre, Arantxa; Centeno, Alba; Zurutuza, Amaia; Van Campenhout, Joris; Huyghebaert, Cedric; Van Thourhout, Dries; Pantouvaki, Marianna (2023)