Browsing by author "Vandersmissen, Kevin"
Now showing items 21-40 of 49
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Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-Silicon Via Interconnects
Civale, Yann; Armini, Silvia; Philipsen, Harold; Redolfi, Augusto; Velenis, Dimitrios; Croes, Kristof; Heylen, Nancy; El-Mekki, Zaid; Vandersmissen, Kevin; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Extending the Cu metallization and alternatives
van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Vandersmissen, Kevin; Wilson, Chris; Varela Pedreira, Olalla; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2017) -
Forksheet FETs for Advanced CMOS Scaling: Forksheet-Nanosheet Co-Integration and Dual Work Function Metal Gates at 17nm N-P Space
Mertens, Hans; Ritzenthaler, Romain; Oniki, Yusuke; Briggs, Basoene; Chan, BT; Hikavyy, Andriy; Hopf, Toby; Mannaert, Geert; Tao, Zheng; Sebaai, Farid; Peter, Antony; Vandersmissen, Kevin; Dupuy, Emmanuel; Rosseel, Erik; Batuk, Dmitry; Geypen, Jef; Martinez Alanis, Gerardo Tadeo; Abigail, Daniel_; Grieten, Eva; D'have, Koen; Mitard, Jerome; Subramanian, Sujith; Ragnarsson, Lars-Ake; Weckx, Pieter; Chehab, Bilal; Hellings, Geert; Ryckaert, Julien; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021) -
Forksheet FETs with Bottom Dielectric Isolation, Self-Aligned Gate Cut, and Isolation between Adjacent Source-Drain Structures
Mertens, Hans; Ritzenthaler, Romain; Oniki, Yusuke; Puttarame Gowda, Pallavi; Mannaert, Geert; Sebaai, Farid; Hikavyy, Andriy; Rosseel, Erik; Dupuy, Emmanuel; Peter, Antony; Vandersmissen, Kevin; Radisic, Dunja; Briggs, Basoene; Batuk, Dmitry; Geypen, Jef; Martinez Alanis, Gerardo Tadeo; Seidel, Felix; Richard, Olivier; Chan, BT; Mitard, Jerome; Dentoni Litta, Eugenio; Horiguchi, Naoto (2022) -
Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab
Wu, Cheng Han; Brems, Steven; Yudistira, Didit; Cott, Daire; Milenin, Alexey; Vandersmissen, Kevin; Maestre, A.; Centero, A.; Van Campenhout, Joris; Huyghebaert, Cedric; Pantouvaki, Marianna (2021) -
High yield and process uniformity for 300 mm integrated WS2 FETs
Schram, Tom; Smets, Quentin; Radisic, Dunja; Groven, Benjamin; Thiam, Arame; Li, Waikin; Dupuy, Emmanuel; Vandersmissen, Kevin; Maurice, Thibaut; Asselberghs, Inge; Radu, Iuliana (2021) -
Impact of ELD layers in mechanical properties of microbumps for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; De Wolf, Ingrid (2016) -
Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems
De Preter, Inge; Derakhshandeh, Jaber; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric (2011-06) -
Key elements for sub-50μm pitch micro bump processes
De Vos, Joeri; Bogaerts, Lieve; Buisson, Thibault; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio; Beyne, Eric (2013) -
Large area copper plated silicon solar cell exceeding 19.5% efficiency
Tous, Loic; Russell, Richard; Das, Jo; Labie, Riet; Ngamo, Michel; Horzel, Jörg; Philipsen, Harold; Sniekers, Jeroen; Vandersmissen, Kevin; van den Brekel, Lukas; Janssens, Tom; Aleman, Monica; van Dorp, Dennis; Poortmans, Jef; Mertens, Robert (2012) -
Metallization for 3D interconnect processing
Philipsen, Harold; Civale, Yann; Vandersmissen, Kevin; Honore, Mia; Inoue, Fumihiro; Leunissen, Peter (2012) -
Metrology for monitoring and detecting process issues in a TSV module
Philipsen, Harold; Vandersmissen, Kevin; Cockburn, Andrew; Erickson, David; Drijbooms, Chris; Moussa, Alain; Bender, Hugo; Struyf, Herbert (2014) -
Microbump development on small bump pitch (50μm and lower)
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012) -
Modeling of via resistance for advanced technology nodes
Ciofi, Ivan; Roussel, Philippe; Saad, Yves; Moroz, Victor; Hu, Jojo; Baert, Rogier; Croes, Kristof; Contino, Antonino; Vandersmissen, Kevin; Gao, Weimin; Matagne, Philippe; Badaroglu, Mustafa; Wilson, Chris; Mocuta, Dan; Tokei, Zsolt (2017) -
Nucleation and growth kinetics of electrodeposited Ni films on Si(100) surfaces
Philipsen, Harold; Jehoul, Hannes; Inoue, Fumihiro; Vandersmissen, Kevin; Yang, Liu; Struyf, Herbert; van Dorp, Dennis (2017) -
Photoresist stripping by Ozone/water processes: effect of additives
Vankerckhoven, Hans; De Smedt, Frank; Vandersmissen, Kevin; Claes, Martine; De Gendt, Stefan; Heyns, Marc; Vinckier, Chris (2005) -
Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch
Bogaerts, Lieve; De Vos, Joeri; Gerets, Carine; Jamieson, Geraldine; Vandersmissen, Kevin; La Manna, Antonio (2012-12) -
Reliability study on cobalt and ruthenium as alternative metals for advance interconnects
Varela Pedreira, Olalla; Croes, Kristof; Lesniewska, Alicja; Wu, Chen; van der Veen, Marleen; De Messemaeker, Joke; Vandersmissen, Kevin; Jourdan, Nicolas; Wen, Liang Gong; Adelmann, Christoph; Briggs, Basoene; Vega Gonzalez, Victor; Boemmels, Juergen; Tokei, Zsolt (2017) -
Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails
Veloso, Anabela; Jourdain, Anne; Radisic, Dunja; Chen, Rongmei; Arutchelvan, Goutham; O'Sullivan, Barry; Arimura, Hiroaki; Stucchi, Michele; De Keersgieter, An; Hosseini, Maryam; Hopf, Toby; D'have, Koen; Wang, Shouhua; Dupuy, Emmanuel; Mannaert, Geert; Vandersmissen, Kevin; Iacovo, Serena; Marien, Philippe; Choudhury, Subhobroto; Schleicher, Filip; Sebaai, Farid; Oniki, Yusuke; Zhou, X.; Gupta, Anshul; Schram, Tom; Briggs, Basoene; Lorant, Christophe; Rosseel, Erik; Hikavyy, Andriy; Loo, Roger; Geypen, Jef; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Soulie, Jean-Philippe; Devriendt, Katia; Chan, BT; Demuynck, Steven; Hiblot, Gaspard; Van der Plas, Geert; Ryckaert, Julien; Beyer, Gerald; Dentoni Litta, Eugenio; Beyne, Eric; Horiguchi, Naoto (2022)