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Book chapters
Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application
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Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application
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Date
2019
Book Chapter
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Milojevic, Dragomir
;
Agrawal, Prashant
;
Raghavan, Praveen
;
Van der Plas, Geert
;
Catthoor, Francky
;
Van der Perre, Liesbet
;
Velenis, Dimitrios
;
Varadarajan, Ravi
;
Beyne, Eric
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1977
since deposited on 2021-10-27
Acq. date: 2025-12-11
Citations
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Views
1977
since deposited on 2021-10-27
Acq. date: 2025-12-11
Citations