Publication:

Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application

Date

2019
Book Chapter
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dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorAgrawal, Prashant
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorCatthoor, Francky
dc.contributor.authorVan der Perre, Liesbet
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVaradarajan, Ravi
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorAgrawal, Prashant
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T14:00:45Z
dc.date.available2021-10-27T14:00:45Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33590
dc.identifier.urlhttps://doi.org/10.1002/9783527697052.ch2
dc.source.beginpage21
dc.source.bookHandbook of 3D Integration - Vol.4: Design, Test and Thermal Management
dc.source.endpage40
dc.title

Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application

dc.typeBook chapter
dspace.entity.typePublication
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