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Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers
Publication:
Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers
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Date
2024
Journal article
https://doi.org/10.1117/1.JOM.4.1.011004
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Coenen, David
;
Kim, Minkyu
;
Oprins, Herman
;
Ban, Yoojin
;
Velenis, Dimitrios
;
Van Campenhout, Joris
;
De Wolf, Ingrid
Journal
JOURNAL OF OPTICAL MICROSYSTEMS
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since deposited on 2024-09-14
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Downloads
120
since deposited on 2024-09-14
9
last month
2
last week
Acq. date: 2025-12-15
Views
343
since deposited on 2024-09-14
1
last month
Acq. date: 2025-12-15
Citations