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Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers
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Acq. date: 2026-04-27
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203 since deposited on 2024-09-14
21last month
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Acq. date: 2026-04-27
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344 since deposited on 2024-09-14
Acq. date: 2026-04-27
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