Publication:

Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers

Date

2024
Journal article
https://doi.org/10.1117/1.JOM.4.1.011004
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dc.contributor.authorCoenen, David
dc.contributor.authorKim, Minkyu
dc.contributor.authorOprins, Herman
dc.contributor.authorBan, Yoojin
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorCoenen, David
dc.contributor.imecauthorKim, Minkyu
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCoenen, David::0000-0002-3732-1874
dc.contributor.orcidimecKim, Minkyu::0000-0002-8999-2303
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBan, Yoojin::0000-0001-7319-8132
dc.contributor.orcidimecVelenis, Dimitrios::0000-0001-7947-8098
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2025-02-06T10:37:19Z
dc.date.available2024-09-14T17:21:34Z
dc.date.available2025-02-06T10:37:19Z
dc.date.embargo2023-12-31
dc.date.issued2024
dc.identifier.doi10.1117/1.JOM.4.1.011004
dc.identifier.issn1932-5150
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44492
dc.publisherSPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
dc.source.beginpageArt. 011004
dc.source.endpageN/A
dc.source.issue1
dc.source.journalJOURNAL OF OPTICAL MICROSYSTEMS
dc.source.numberofpages14
dc.source.volume4
dc.title

Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers

dc.typeJournal article
dspace.entity.typePublication
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