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Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions
Publication:
Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions
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Date
1999
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Teerlinck, Ivo
;
Gomes, W.
;
Mertens, Paul
;
Heyns, Marc
Journal
Abstract
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1891
since deposited on 2021-10-14
Acq. date: 2025-12-15
Citations
Metrics
Views
1891
since deposited on 2021-10-14
Acq. date: 2025-12-15
Citations