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Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions

Date

1999
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dc.contributor.authorTeerlinck, Ivo
dc.contributor.authorGomes, W.
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.date.accessioned2021-10-14T11:42:44Z
dc.date.available2021-10-14T11:42:44Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3875
dc.source.conferenceMRS Spring Meeting Symposium on Ultraclean Processing of Semiconductor Structures and Devices; April 1999
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Electrochemical study on the mechanism of copper depostion on silicon surfaces in HF solutions

dc.typeOral presentation
dspace.entity.typePublication
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