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Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
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Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
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Date
2012
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ivankovic, Andrej
;
Vanstreels, Kris
;
Vanderstraeten, Daniel
;
Brizar, Guy
;
Gillon, Renaud
;
Blansaer, Eddy
;
Vandevelde, Bart
Journal
Microelectronics Reliability
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1917
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Acq. date: 2025-12-11
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Metrics
Views
1917
since deposited on 2021-10-20
3
last month
2
last week
Acq. date: 2025-12-11
Citations