Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

dc.contributor.author	Ivankovic, Andrej
dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Vanderstraeten, Daniel
dc.contributor.author	Brizar, Guy
dc.contributor.author	Gillon, Renaud
dc.contributor.author	Blansaer, Eddy
dc.contributor.author	Vandevelde, Bart
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned	2021-10-20T11:49:44Z
dc.date.available	2021-10-20T11:49:44Z
dc.date.issued	2012
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/20853
dc.source.beginpage	2677
dc.source.endpage	2684
dc.source.issue	11
dc.source.journal	Microelectronics Reliability
dc.source.volume	52
dc.title	Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
dc.type	Journal article
dspace.entity.type	Publication
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