Publication:

Influence of contact area on oxide-oxide fusion bonding quality between 200mm quartz and silicon wafers

Date

2017
Presentation
Simple item page Full metadata Statistics
 
dc.contributor.authorBuja, Federico
dc.contributor.authorHumbert, Aurelie
dc.contributor.authorVisker, Jakob
dc.contributor.authorPeng, Lan
dc.contributor.imecauthorHumbert, Aurelie
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorPeng, Lan
dc.contributor.orcidimecHumbert, Aurelie::0000-0002-2538-8991
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.date.accessioned2021-10-24T03:12:04Z
dc.date.available2021-10-24T03:12:04Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27942
dc.identifier.urlhttp://www.waferbond-conference2017.org/index.php/topics/2-uncategorised/13-posters-waferbond-conference
dc.source.conferenceInternational Conference on Wafer Bonding - WAFERBOND
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
dc.title

Influence of contact area on oxide-oxide fusion bonding quality between 200mm quartz and silicon wafers

dc.typeOral presentation
dspace.entity.typePublication
Files
Publication available in collections:
Presentations