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Optimierung von IC-Gehäusen durch Modellierung der Zuverlässigkeit unter Einfluß thermisch bedingter Materialermüdung
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1 since deposited on 2021-10-14
Acq. date: 2026-01-06
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1926 since deposited on 2021-10-14
Acq. date: 2026-01-06
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1 since deposited on 2021-10-14
Acq. date: 2026-01-06
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1926 since deposited on 2021-10-14
Acq. date: 2026-01-06
Citations