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Optimierung von IC-Gehäusen durch Modellierung der Zuverlässigkeit unter Einfluß thermisch bedingter Materialermüdung
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Optimierung von IC-Gehäusen durch Modellierung der Zuverlässigkeit unter Einfluß thermisch bedingter Materialermüdung
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Date
2000
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marent, Katrien
;
Vandevelde, Bart
Journal
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since deposited on 2021-10-14
Acq. date: 2025-12-15
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since deposited on 2021-10-14
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Acq. date: 2025-12-15
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Downloads
1
since deposited on 2021-10-14
Acq. date: 2025-12-15
Views
1926
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-15
Citations