Publication:
Optimierung von IC-Gehäusen durch Modellierung der Zuverlässigkeit unter Einfluß thermisch bedingter Materialermüdung
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-6753-6438 | |
| cris.virtualsource.department | 8cdcc398-7fc4-47d1-8f73-d981b615c540 | |
| cris.virtualsource.department | 0aefe159-9129-4bab-908e-3a73693ee2e4 | |
| cris.virtualsource.orcid | 8cdcc398-7fc4-47d1-8f73-d981b615c540 | |
| cris.virtualsource.orcid | 0aefe159-9129-4bab-908e-3a73693ee2e4 | |
| dc.contributor.author | Marent, Katrien | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Marent, Katrien | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-14T13:20:25Z | |
| dc.date.available | 2021-10-14T13:20:25Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2000 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/4564 | |
| dc.source.beginpage | 22 | |
| dc.source.endpage | 25 | |
| dc.source.issue | 7 | |
| dc.source.journal | SMT Packaging | |
| dc.title | Optimierung von IC-Gehäusen durch Modellierung der Zuverlässigkeit unter Einfluß thermisch bedingter Materialermüdung | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |