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Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging
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Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging
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Date
2016
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kljucar, Luka
;
Gonzalez, Mario
;
Croes, Kristof
;
De Wolf, Ingrid
;
Murdoch, Gayle
;
De Vos, Joeri
;
Boemmels, Juergen
;
Beyne, Eric
;
Tokei, Zsolt
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1923
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations
Metrics
Views
1923
since deposited on 2021-10-23
Acq. date: 2025-12-15
Citations