Publication:

Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

Date

2016
Proceedings Paper
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dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorBeyne, Eric
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T11:49:46Z
dc.date.available2021-10-23T11:49:46Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26836
dc.source.beginpage1778
dc.source.conferenceIEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2016
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1785
dc.title

Impact of via density on the mechanical integrity of advanced Back-End-Of-Line during packaging

dc.typeProceedings paper
dspace.entity.typePublication
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