Publication:
Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
Date
Loading...
Files
Journal
Abstract
Description
Metrics
Views
1985 since deposited on 2021-10-20
1last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1985 since deposited on 2021-10-20
1last month
Acq. date: 2025-12-15
Citations