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Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
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1983 since deposited on 2021-10-20
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Acq. date: 2025-10-24
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Views
1983 since deposited on 2021-10-20
434item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations