Publication:

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

Date

2012-12
Journal article
Simple item page Full metadata Statistics
 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-0111-431X
cris.virtual.orcid0000-0002-4667-5092
cris.virtualsource.departmentba97b4e2-c6d5-45c4-b9b4-75cedecd7d74
cris.virtualsource.departmentb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.orcidba97b4e2-c6d5-45c4-b9b4-75cedecd7d74
cris.virtualsource.orcidb32be2a6-49e5-4859-8aac-84fd4f5bec8e
dc.contributor.authorKeyvaninia, Shahram
dc.contributor.authorMuneeb, Muhammad
dc.contributor.authorStankovic, Stevan
dc.contributor.authorvan Veldhoven, P.J.
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.contributor.imecauthorMuneeb, Muhammad
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.accessioned2021-10-20T12:11:44Z
dc.date.available2021-10-20T12:11:44Z
dc.date.embargo9999-12-31
dc.date.issued2012-12
dc.identifier.issn2159-3930
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20923
dc.source.beginpage35
dc.source.endpage46
dc.source.issue1
dc.source.journalOptical Materials Express
dc.source.volume3
dc.title

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
27277.pdf
Size:
965.32 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles