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Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch
Publication:
Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch
Date
2013
Meeting abstract
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26208.pdf
164.11 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Schepper, Peter
;
Hansen, Terje
;
Vaglio Pret, Alessandro
;
Altamirano Sanchez, Efrain
;
Boullart, Werner
;
De Gendt, Stefan
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Abstract
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1918
since deposited on 2021-10-21
3
last week
Acq. date: 2025-10-29
Citations
Metrics
Views
1918
since deposited on 2021-10-21
3
last week
Acq. date: 2025-10-29
Citations