Publication:

Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch

Date

 
dc.contributor.authorDe Schepper, Peter
dc.contributor.authorHansen, Terje
dc.contributor.authorVaglio Pret, Alessandro
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorBoullart, Werner
dc.contributor.authorDe Gendt, Stefan
dc.contributor.imecauthorDe Schepper, Peter
dc.contributor.imecauthorVaglio Pret, Alessandro
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-21T07:10:38Z
dc.date.available2021-10-21T07:10:38Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22218
dc.source.conferencePlasma Etch and Strip in Microtechnology - PESM
dc.source.conferencedate14/03/2013
dc.source.conferencelocationLeuven Belgium
dc.title

Line edge and width roughness mitigation at 22nm half pitch: plasma polymer interaction and roughness mitigation through etch

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
26208.pdf
Size:
164.11 KB
Format:
Adobe Portable Document Format
Publication available in collections: