Electronic-Photonic Integrated Circuits through Micro-Transfer Printing

Abstract

We realized low-ohmic, high-speed interconnects to transfer-printed, 20 μm thick electronic chiplets with small (20 μm×20μm) pads. Spray-coated divinylsiloxane-bis-benzocyclobuten (DVS-BCB) ramps were created, onto which a lithographically defined metal redistribution layer including vias was fabricated. This approach facilitates short (low parasitic) interconnects between electronics and photonics.