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Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces
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Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces
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Date
2009
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Le, Quoc Toan
;
Claes, Martine
;
Conard, Thierry
;
Kesters, Els
;
Lux, Marcel
;
Vereecke, Guy
Journal
Microelectronic Engineering
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1803
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Acq. date: 2025-12-15
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Metrics
Views
1803
since deposited on 2021-10-17
2
last month
Acq. date: 2025-12-15
Citations