Publication:
Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
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| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0009-0007-6964-7434 | |
| cris.virtual.orcid | 0000-0001-9058-9338 | |
| cris.virtual.orcid | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-0206-6279 | |
| cris.virtual.orcid | 0000-0002-4298-5851 | |
| cris.virtual.orcid | 0009-0007-5291-7274 | |
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| cris.virtualsource.department | 3b07f0cf-e8a1-4279-9e7b-9b256ec03e01 | |
| cris.virtualsource.department | ba3e091f-980b-41bd-8a84-0539bdb43b15 | |
| cris.virtualsource.department | 48bfd15f-f536-4f48-9ea7-2d49147c7051 | |
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| cris.virtualsource.orcid | 3b07f0cf-e8a1-4279-9e7b-9b256ec03e01 | |
| cris.virtualsource.orcid | ba3e091f-980b-41bd-8a84-0539bdb43b15 | |
| cris.virtualsource.orcid | 48bfd15f-f536-4f48-9ea7-2d49147c7051 | |
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| cris.virtualsource.orcid | a2d81e75-02fd-46fe-acea-f3d7c05fe2c9 | |
| dc.contributor.author | Le, Quoc Toan | |
| dc.contributor.author | Claes, Martine | |
| dc.contributor.author | Conard, Thierry | |
| dc.contributor.author | Kesters, Els | |
| dc.contributor.author | Lux, Marcel | |
| dc.contributor.author | Vereecke, Guy | |
| dc.contributor.imecauthor | Le, Quoc Toan | |
| dc.contributor.imecauthor | Claes, Martine | |
| dc.contributor.imecauthor | Conard, Thierry | |
| dc.contributor.imecauthor | Kesters, Els | |
| dc.contributor.imecauthor | Lux, Marcel | |
| dc.contributor.imecauthor | Vereecke, Guy | |
| dc.contributor.orcidimec | Le, Quoc Toan::0000-0002-0206-6279 | |
| dc.contributor.orcidimec | Conard, Thierry::0000-0002-4298-5851 | |
| dc.contributor.orcidimec | Vereecke, Guy::0000-0001-9058-9338 | |
| dc.date.accessioned | 2021-10-17T23:50:31Z | |
| dc.date.available | 2021-10-17T23:50:31Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2009 | |
| dc.identifier.issn | 0167-9317 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15676 | |
| dc.source.beginpage | 181 | |
| dc.source.endpage | 185 | |
| dc.source.issue | 2 | |
| dc.source.journal | Microelectronic Engineering | |
| dc.source.volume | 86 | |
| dc.title | Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |