Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces

dc.contributor.author	Le, Quoc Toan
dc.contributor.author	Claes, Martine
dc.contributor.author	Conard, Thierry
dc.contributor.author	Kesters, Els
dc.contributor.author	Lux, Marcel
dc.contributor.author	Vereecke, Guy
dc.contributor.imecauthor	Le, Quoc Toan
dc.contributor.imecauthor	Claes, Martine
dc.contributor.imecauthor	Conard, Thierry
dc.contributor.imecauthor	Kesters, Els
dc.contributor.imecauthor	Lux, Marcel
dc.contributor.imecauthor	Vereecke, Guy
dc.contributor.orcidimec	Le, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimec	Conard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimec	Vereecke, Guy::0000-0001-9058-9338
dc.date.accessioned	2021-10-17T23:50:31Z
dc.date.available	2021-10-17T23:50:31Z
dc.date.embargo	9999-12-31
dc.date.issued	2009
dc.identifier.issn	0167-9317
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/15676
dc.source.beginpage	181
dc.source.endpage	185
dc.source.issue	2
dc.source.journal	Microelectronic Engineering
dc.source.volume	86
dc.title	Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces
dc.type	Journal article
dspace.entity.type	Publication
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