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Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
Publication:
Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
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Date
2022
Proceedings Paper
https://doi.org/10.1109/IEDM45625.2022.10019349
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Chen, Rongmei
;
Lofrano, Melina
;
Mirabelli, Gioele
;
Sisto, Giuliano
;
Yang, Sheng
;
Jourdain, Anne
;
Schleicher, Filip
;
Veloso, Anabela
;
Zografos, Odysseas
;
Weckx, Pieter
;
Hiblot, Gaspard
;
Van der Plas, Geert
;
Hellings, Geert
;
Ryckaert, Julien
;
Beyne, Eric
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na
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1330
since deposited on 2023-05-25
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Acq. date: 2025-12-11
Citations
Metrics
Views
1330
since deposited on 2023-05-25
4
last month
1
last week
Acq. date: 2025-12-11
Citations