Publication:
Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network
| dc.contributor.author | Chen, Rongmei | |
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Mirabelli, Gioele | |
| dc.contributor.author | Sisto, Giuliano | |
| dc.contributor.author | Yang, Sheng | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Schleicher, Filip | |
| dc.contributor.author | Veloso, Anabela | |
| dc.contributor.author | Zografos, Odysseas | |
| dc.contributor.author | Weckx, Pieter | |
| dc.contributor.author | Hiblot, Gaspard | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Hellings, Geert | |
| dc.contributor.author | Ryckaert, Julien | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Chen, Rongmei | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Mirabelli, Gioele | |
| dc.contributor.imecauthor | Sisto, Giuliano | |
| dc.contributor.imecauthor | Yang, Sheng | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Schleicher, Filip | |
| dc.contributor.imecauthor | Veloso, Anabela | |
| dc.contributor.imecauthor | Zografos, Odysseas | |
| dc.contributor.imecauthor | Weckx, Pieter | |
| dc.contributor.imecauthor | Hiblot, Gaspard | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Hellings, Geert | |
| dc.contributor.imecauthor | Ryckaert, Julien | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Mirabelli, Gioele::0000-0001-7060-4836 | |
| dc.contributor.orcidimec | Sisto, Giuliano::0000-0001-8706-4311 | |
| dc.contributor.orcidimec | Yang, Simei::0000-0002-0130-8176 | |
| dc.contributor.orcidimec | Schleicher, Filip::0000-0003-3630-7285 | |
| dc.contributor.orcidimec | Zografos, Odysseas::0000-0002-9998-8009 | |
| dc.contributor.orcidimec | Hiblot, Gaspard::0000-0002-3869-965X | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.contributor.orcidimec | Hellings, Geert::0000-0002-5376-2119 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Lofrano, Melina::0000-0002-3930-6459 | |
| dc.contributor.orcidimec | Yang, Sheng::0000-0002-0658-5316 | |
| dc.contributor.orcidimec | Jourdain, Anne::0000-0002-7610-0513 | |
| dc.date.accessioned | 2023-06-01T15:39:18Z | |
| dc.date.available | 2023-05-25T20:20:00Z | |
| dc.date.available | 2023-06-01T15:39:18Z | |
| dc.date.issued | 2022 | |
| dc.identifier.doi | 10.1109/IEDM45625.2022.10019349 | |
| dc.identifier.eisbn | 978-1-6654-8959-1 | |
| dc.identifier.issn | 2380-9248 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41618 | |
| dc.publisher | IEEE | |
| dc.source.conference | International Electron Devices Meeting (IEDM) | |
| dc.source.conferencedate | DEC 03-07, 2022 | |
| dc.source.conferencelocation | San Francisco | |
| dc.source.journal | na | |
| dc.source.numberofpages | 4 | |
| dc.title | Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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