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Ultra-low damage integration of k= 2.3 periodic mesoporous oxide dielectric material using cryogenic etching

Date

2014
Meeting abstract
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dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorZhang, Liping
dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorGoodyear, Andy
dc.contributor.authorCooke, Mike
dc.contributor.authorHeylen, Nancy
dc.contributor.authorCiofi, Ivan
dc.contributor.authorWen, Liang Gong
dc.contributor.authorWilson, Chris
dc.contributor.authorSavage, Travis
dc.contributor.authorMatsunaga, Koichi
dc.contributor.authorNafus, Kathleen
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorNafus, Kathleen
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.date.accessioned2021-10-22T01:06:56Z
dc.date.available2021-10-22T01:06:56Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23709
dc.source.beginpageCC1.04
dc.source.conferenceMRS Spring Meeting Symposium CC: New Materials and Processes for Interconnects, Novel Memory and Advanced Display Technologies
dc.source.conferencedate21/04/2014
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Ultra-low damage integration of k= 2.3 periodic mesoporous oxide dielectric material using cryogenic etching

dc.typeMeeting abstract
dspace.entity.typePublication
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