Publication:
Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects
Date
Loading...
Files
Journal
Abstract
Description
Statistics
Views
1893 since deposited on 2021-10-21
2last month
Acq. date: 2026-04-27
Citations
Statistics
Views
1893 since deposited on 2021-10-21
2last month
Acq. date: 2026-04-27
Citations