Publication:

Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

Date

2012-05
Proceedings Paper
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dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorVermeersch, Kristina
dc.contributor.authorGerets, Carine
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-20T14:06:42Z
dc.date.available2021-10-20T14:06:42Z
dc.date.issued2012-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21234
dc.source.beginpage1395
dc.source.conference13th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm
dc.source.conferencedate30/05/2012
dc.source.conferencelocationSan Diego, CA USA
dc.source.endpage1404
dc.title

Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

dc.typeProceedings paper
dspace.entity.typePublication
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